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ENEPIG


ENEPIG process

1. Utilize pure palladium for surface coating.
2. Low inner tension of the palladium layer, no binding or cracking issues.
3. Stable deposition rate regardless of long holding time.
4. Palladium layer provide a separation between nickel and gold, avoiding the diffusion of nickel to the gold surface and therefore minimizing nickel corrosion.
5. Able to achieve 0.2~0.3μm gold coating thickness on palladium surface.
6. Reduction reaction, superior chemical stability, long life cycle, and no precipitation.
7. Excellent soldering and bonding performance.
8. Great gold bonding performance, and can replace thick gold layer and electroplate soft gold plating layer.
9. No palladium precipitation in the bath, and maintain uniform palladium thickness.





  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

 Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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