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RDL Cu Plating

RDL Copper Plating

Product introduction: CZ210M/A/B/C/D are plating solutions of high-performance DC copper sulfate system. They employ the advantages of low consumption of brightener, and superior even plating capability, making them suitable for RDL plating in wafer level packaging, Cu-Pillar and regular TSV with low depth ratio, etc. The plating film has good luster, flexibility, uniformity, and low internal stress, which can meet the performance standards of different  downstream customers.

Product features:

1. Optimal copper thickness distribution and wafer uniformity.

2. Reliable gap filling for stable pattern plating.

3. Low warp distortion and internal stress .

4. Dense crystallization on copper surface.

  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

 Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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