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RDL/UBM/Bump Nickel Plating


RDL、UBMBump Nickel Plating


Product introduction: CZ601 are a series of a nickel plating solutions, specifically developed for Wafer plating. The greatest advantage is to provide high speed for nickel plating while minimizing internal stress and providing a good nickel barrier for RDL、UBMBump.


Product features:

1. Uniform nickel distribution of diffusion barrier.

2. Low porosity, good flexibility and low stress.

3. Higher plating rate.




  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

 Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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