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UBM/Au bump Au plating


UBMAu bump Au Plating


Product introduction: CZ602 are a series of environment-friendly CN-free, and weakly acidic plating solutions, which can form highly pure Au plating film with 99.99% gold. CZ602 is different from the traditional CN-free Au plating solution because of its long withholding time and chemical stability. For example, even if the solution is not used for a long time after preparation, the Au content will not precipitate leading to lower Au concentration. Furthermore, CZ602 is a pure(soft) gold plating solution specifically designed for wafer level packaging, RDL and Au-Bump, etc. The plating has excellent uniformity, and fast deposition rate.


Product features:

1. Environmental-friendly CN-free Au plating bath.

2. Low Au concentration, high current density, low cost, and high output.

3. Dense plating crystallization and high purity.

4. Excellent thickness distribution.


  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

 Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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