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Electrolytic Tinning Bump

Electrolytic Tinning Bump

Product introduction: CZ506 are series of solutions for MS-Tin type tin plating process, producing a plating layer with excellent solderability. High plating efficiency can be achieved even at low metal concentrations. Under high thickness to depth ratio, CZ506 can create a plating layer with good uniformity and even distribution, optimal for wafer level packaging such as Sn-BUMP.

Product features:

1. Producing matte pure tin finishing of dense crystallization.

2. Excellent thickness distribution on wafer bump , and uniform alloy distribution.

3. Excellent solderability.



  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

 Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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