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Super TSV Process

Super TSV Process

Product introduction:CZ608 is a typical BOTTOM-UP copper plating system suitable for blind via hole with different depth ratios. With thin surface copper layer, the inner copper layer can be filled tight with zero defects inside the hole.

Product features:

1. Efficient super filling with large depth to diameter ratio TSV structure.

2. Uniform copper distribution and minimize over-plating.

3. Even copper plating without void space within extremely small structures

4. Low defect density after CMP.

5. Wide operation range of additives.

  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

 Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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