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Environment-friendly Glue Removing Solution


CZ826 Environment-friendly Glue Removing Solution


Product introduction: CZ826/CZ826H are environment-friendly glue removing solutions used for wafer level packaging, CZ826 are mainly used for glue

removing treatment before and after wafer plating.


Product features:

1. Environment-friendly solvents impose no health hazard to human and environment with extremely low VOCs(volatile organic compounds) content in the air.

2. High boiling point raw materials with close to zero vaporization of the effective ingredients. Stable concentration and lowered cost.

3. No irritating odor, and easy to operate.

4. Completely dissolve the film instead of stripping, resulting no residues that could clog the nozzles.

5. Water soluble and easy to clean.

6. Compatible with PE, PVC, PP, stainless steel, Teflon equipment and packing barrel.

  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

 Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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