Automatic Electroplating Equipment

Automatic Wafer Level Packaging Electroplating Equipment

Features:

1.Fully automated operation.

2.Compatible with multiple size wafers.

3.Compatible with different electroplating requirements.

4.Industrial Personal Computer(IPC) control system and windows operating system.

5.EAP system and video monitor-record system.

6.RFID automatic recognition.

7.Equipment size: 5300*2200*2500mm

8.Power: 56KW/100A/380V

9.Capacity: 15000 wafers per month

10. Application: Electroplating Cu, Electroplating Sn, Electroplating Sn-Ag Alloy, Electroplating Ni, Electroplating Au.

Full Service

Provide professional technical
support and track service
Quality Assurance

Over ten years expertise and
professional technical support
Superior cost to performance ratio

Best service and best price
guarantee the best production.
High accuracy equipmen

Various high accuracy equipment
to support our R&D and service.
Solution optimization

Continuously exploring the
optimized solution to improve
quality and added values.

Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

Tel: 0755-27367080/27380953

Email: market@czcgkj.com

Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD

Tel: 0513-86968166

Email: czcghb@szwin.cn

Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu