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Automatic Electroplating Equipment

Automatic Wafer Level Packaging Electroplating Equipment


1.Fully automated operation.

2.Compatible with multiple size wafers.

3.Compatible with different electroplating requirements.

4.Industrial Personal Computer(IPC) control system and windows operating system.

5.EAP system and video monitor-record system.

6.RFID automatic recognition.

7.Equipment size: 5300*2200*2500mm

8.Power: 56KW/100A/380V

9.Capacity: 15000 wafers per month

10. Application: Electroplating Cu, Electroplating Sn, Electroplating Sn-Ag Alloy, Electroplating Ni, Electroplating Au.

  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

     Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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