ENIG

Mid P-content/High P-content Ni layer selective ENIG process 

1. Excellent ability to resist contamination.

2. Minimized extraneous Ni plating and discoloration after SO₂ test in PCB industry.

3. The gold thickness can reach 2-3 u" to resolve the insufficient gold thickness problem of high phosphorus-content nickel layer ENIG board.

4. Highly resistance to over plating and skip plating in tight circuit.

ENIG (Mid phosphorus-content nickel layer) process

1. The depth of nickel corrosion is less than 1/5 of total thickness, and corrosion point is less than two.

2. Highly resistance to over plating and skip plating to the tight lines and space.

3. Low gold concentration, uniform gold layer, leading to reduced gold salts.

Mid phosphorus-content/High phosphorus-content nickel layer ENIG process for FPC

1. No crack or damaged after 100 times of bending (ф1.0mm X degrees 180).

2. The production control of High P-content Ni layer ENIG process for FPC is as simple as Mid P-content Ni layer ENIG process.

3. The Au thickness can attain 2-3 u" to solve the lack of Au thickness problem of High P-content Ni layer ENIG for FPC.

High corrosion resistance ENIG Process 

1. Excellent crystal lattice of Ni layer, stable P-content , compacted Au layer, minimum attack to Ni layer and highly resistant to corrosion.(black pad)

2. Resisted 3 times OSP process; resist 48h salt spray test without peeling, discoloration.

3. Ni corrosion resistance performance achieved the highest standard in PCB industry: the nickel corrosion depth is less than 1/5 nickel layer and corrosion 

    point is less than two, analyzed by the SEM analysis with 5000X magnification (within the scope of 30um) of micro-section after Sn immersion.