ENEPIG

ENEPIG process

1. Utilize pure palladium for surface coating.
2. Low inner tension of the palladium layer, no binding or cracking issues.
3. Stable deposition rate regardless of long holding time.
4. Palladium layer provide a separation between nickel and gold, avoiding the diffusion of nickel to the gold surface and therefore minimizing nickel corrosion.
5. Able to achieve 0.2~0.3μm gold coating thickness on palladium surface.
6. Reduction reaction, superior chemical stability, long life cycle, and no precipitation.
7. Excellent soldering and bonding performance.
8. Great gold bonding performance, and can replace thick gold layer and electroplate soft gold plating layer.
9. No palladium precipitation in the bath, and maintain uniform palladium thickness.