Blind-via Cu plating

Blind via hole copper plating process for PCB

With the development of HDI technology in PCB industry, the blind via hole plating process has 
become a key technology that support the latest development of the industry. Chuangzhi technology
 has successfully developed series of high-end products of the blind-via hole plating additives CZ618.
 
1. Ultrathin copper layer.
2. Suitable for PNL plating and pattern electroplating (blind via hole diameter within 150µm).
3. Suitable for PTH.
4. Suitable for circular VCP electroplating equipment.
5. Suitable for soluble anode and insoluble anode.
6.Different blind via-hole filling requirements and parameters can be achieved by optimization.
7. Automated control of the additives by CVS.