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Blind-via Cu plating

Blind via hole copper plating process for PCB

With the development of HDI technology in PCB industry, the blind via hole plating process has 
become a key technology that support the latest development of the industry. Chuangzhi technology
 has successfully developed series of high-end products of the blind-via hole plating additives CZ618.
1. Ultrathin copper layer.
2. Suitable for PNL plating and pattern electroplating (blind via hole diameter within 150µm).
3. Suitable for PTH.
4. Suitable for circular VCP electroplating equipment.
5. Suitable for soluble anode and insoluble anode.
6.Different blind via-hole filling requirements and parameters can be achieved by optimization.
7. Automated control of the additives by CVS.


  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

     Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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