RDL Cu Plating

RDL Copper Plating

Product introduction: CZ210M/A/B/C/D are plating solutions of high-performance DC copper sulfate system. They employ the advantages of low consumption of brightener, and superior even plating capability, making them suitable for RDL plating in wafer level packaging, Cu-Pillar and regular TSV with low depth ratio, etc. The plating film has good luster, flexibility, uniformity, and low internal stress, which can meet the performance standards of different downstream customers.

Product features:

1. Optimal copper thickness distribution and wafer uniformity.

2. Reliable gap filling for stable pattern plating.

3. Low warp distortion and internal stress .

4. Dense crystallization on copper surface.

Full Service

Provide professional technical
support and track service
Quality Assurance

Over ten years expertise and
professional technical support
Superior cost to performance ratio

Best service and best price
guarantee the best production.
High accuracy equipmen

Various high accuracy equipment
to support our R&D and service.
Solution optimization

Continuously exploring the
optimized solution to improve
quality and added values.

Contact us

Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

Tel: 0755-27367080/27380953

Email: market@czcgkj.com

Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD

Tel: 0513-86968166

Email: czcghb@szwin.cn

Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu