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Pillar/Post Copper Plating

Pillar/Post Copper Plating

Product introduction: CZ616 are a series of high-performance DC plating solutions, with low brightener consumption, strong dispersion capacity and high current capability, making it optimal for Cu-Pillar plating with high aspect ratio in wafer level packaging. The arch rate is extremely low; the plating film has good luster, flexibility, uniformity, and low internal stress, which can meet the performance standards of different downstream customers.

Product features:

1. Optimal copper thickness distribution and wafer uniformity.

2. Extremely low arch rate.

3. Able to operate under high current density(up to 5-10ASD)

4. Dense crystallization on copper surface.

  • Full Service

    Provide professional technical
    support and track service

  • Quality Assurance

    Over ten years expertise and
    professional technical support

  • Superior cost to performance ratio

    Best service and best price
    guarantee the best production.

  • High accuracy equipmen

    Various high accuracy equipment
    to support our R&D and service.

  • Solution optimization

    Continuously exploring the
    optimized solution to improve
    quality and added values.

Contact us

 Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

     Tel: 0755-27367080/27380953

 Email: market@czcgkj.com

 Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

 Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD 

 Tel: 0513-86968166 

 Email: czcghb@szwin.cn  

 Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu                         

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