Pillar/Post Copper Plating

Pillar/Post Copper Plating

Product introduction: CZ616 are a series of high-performance DC plating solutions, with low brightener consumption, strong dispersion capacity and high current capability, making it optimal for Cu-Pillar plating with high aspect ratio in wafer level packaging. The arch rate is extremely low; the plating film has good luster, flexibility, uniformity, and low internal stress, which can meet the performance standards of different downstream customers.

Product features:

1. Optimal copper thickness distribution and wafer uniformity.

2. Extremely low arch rate.

3. Able to operate under high current density(up to 5-10ASD)

4. Dense crystallization on copper surface.

Full Service

Provide professional technical
support and track service
Quality Assurance

Over ten years expertise and
professional technical support
Superior cost to performance ratio

Best service and best price
guarantee the best production.
High accuracy equipmen

Various high accuracy equipment
to support our R&D and service.
Solution optimization

Continuously exploring the
optimized solution to improve
quality and added values.

Contact us

Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

Tel: 0755-27367080/27380953

Email: market@czcgkj.com

Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD

Tel: 0513-86968166

Email: czcghb@szwin.cn

Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu