Bump Nickel Plating

RDL、UBM、Bump Nickel Plating

Product introduction: CZ601 are a series of a nickel plating solutions, specifically developed for Wafer plating. The greatest advantage is to provide high speed for nickel plating while minimizing internal stress and providing a good nickel barrier for RDL、UBM、Bump.

Product features:

1. Uniform nickel distribution of diffusion barrier.

2. Low porosity, good flexibility and low stress.

3. Higher plating rate.

Full Service

Provide professional technical
support and track service
Quality Assurance

Over ten years expertise and
professional technical support
Superior cost to performance ratio

Best service and best price
guarantee the best production.
High accuracy equipmen

Various high accuracy equipment
to support our R&D and service.
Solution optimization

Continuously exploring the
optimized solution to improve
quality and added values.

Contact us

Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

Tel: 0755-27367080/27380953

Email: market@czcgkj.com

Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD

Tel: 0513-86968166

Email: czcghb@szwin.cn

Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu