UBM/Au bump Au plating

Product introduction: CZ602 are a series of environment-friendly CN-free, and weakly acidic plating solutions, which can form highly pure Au plating film with 99.99% gold. CZ602 is different from the traditional CN-free Au plating solution because of its long withholding time and chemical stability. For example, even if the solution is not used for a long time after preparation, the Au content will not precipitate leading to lower Au concentration. Furthermore, CZ602 is a pure(soft) gold plating solution specifically designed for wafer level packaging, RDL and Au-Bump, etc. The plating has excellent uniformity, and fast deposition rate.