Electrolytic Tinning Bump

Product introduction: CZ506 are series of solutions for MS-Tin type tin plating process, producing a plating layer with excellent solderability. High plating efficiency can be achieved even at low metal concentrations. Under high thickness to depth ratio, CZ506 can create a plating layer with good uniformity and even distribution, optimal for wafer level packaging such as Sn-BUMP.

Product features:

1. Producing matte pure tin finishing of dense crystallization.

2. Excellent thickness distribution on wafer bump , and uniform alloy distribution.

3. Excellent solderability.