Common TSV Process

Common TSV Process

Product introduction: CZ606-1 is the copper plating additive system, suitable for blind via holes with various structures and PTH. It can deposit a glossy and dense cooper layer with great flexibility and excellent physical properties. CZ606-1 can produce uniform plating layer inside the blind via hole and the plating surface, or thicker plating layer inside the blind via hole.

Full Service

Provide professional technical
support and track service
Quality Assurance

Over ten years expertise and
professional technical support
Superior cost to performance ratio

Best service and best price
guarantee the best production.
High accuracy equipmen

Various high accuracy equipment
to support our R&D and service.
Solution optimization

Continuously exploring the
optimized solution to improve
quality and added values.

Contact us

Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

Tel: 0755-27367080/27380953

Email: market@czcgkj.com

Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD

Tel: 0513-86968166

Email: czcghb@szwin.cn

Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu