Super TSV Process

Super TSV Process

Product introduction：CZ608 is a typical BOTTOM-UP copper plating system suitable for blind via hole with different depth ratios. With thin surface copper layer, the inner copper layer can be filled tight with zero defects inside the hole.

Product features:

1. Efficient super filling with large depth to diameter ratio TSV structure.

2. Uniform copper distribution and minimize over-plating.

3. Even copper plating without void space within extremely small structures

4. Low defect density after CMP.

5. Wide operation range of additives.