Environment-friendly Glue Removing Solution

CZ826 Environment-friendly Glue Removing Solution

Product introduction: CZ826/CZ826H are environment-friendly glue removing solutions used for wafer level packaging, CZ826 are mainly used for glue

removing treatment before and after wafer plating.

Product features:

1. Environment-friendly solvents impose no health hazard to human and environment with extremely low VOCs(volatile organic compounds) content in the air.

2. High boiling point raw materials with close to zero vaporization of the effective ingredients. Stable concentration and lowered cost.

3. No irritating odor, and easy to operate.

4. Completely dissolve the film instead of stripping, resulting no residues that could clog the nozzles.

5. Water soluble and easy to clean.

6. Compatible with PE, PVC, PP, stainless steel, Teflon equipment and packing barrel.

Full Service

Provide professional technical
support and track service
Quality Assurance

Over ten years expertise and
professional technical support
Superior cost to performance ratio

Best service and best price
guarantee the best production.
High accuracy equipmen

Various high accuracy equipment
to support our R&D and service.
Solution optimization

Continuously exploring the
optimized solution to improve
quality and added values.

Contact us

Group Company: Shenzhen Chuangzhi Core United Technology Co., LTD

Tel: 0755-27367080/27380953

Email: market@czcgkj.com

Address: 1403A, Building 1, Cofco Business Park, Xin 'an Street, Bao 'an District,Shenzhen

Jiangsu Company: Jiangsu Sizhi Semiconductor Technology Co., LTD

Tel: 0513-86968166

Email: czcghb@szwin.cn

Address: No.323, Jinchuan Road, High-tech Industrial Development Zone, Nantong City, Jiangsu